Shanghai Special Program: Large Models for AGI

Shanghai AGI Large Models Special Program — First Batch

Funds foundational AI groups in Shanghai through AGI Large Models support for early large-scale model research.

⚠ This may reflect a past cycle — verify the current call on the funder's site.

The Shanghai AGI Large Models Special Program, administered by the Shanghai Municipal Science and Technology Commission, is a dedicated funding line for foundational artificial-intelligence research underpinning large models and artificial general intelligence. Its first batch covered basic AI theory, large-model reasoning, autonomous agents, multimodal AI, and embodied intelligence. The program is positioned as a basic-research instrument, supporting the theoretical and methodological work behind next-generation AI systems rather than commercial product development.

The first batch was organized into two topics. Topic 1, covering basic AI theories, provides CNY 500,000 per project across nine research directions. Topic 2, covering innovation management, provides CNY 250,000 across three directions. Top-performing projects qualify for second-phase bonuses: an additional CNY 1,000,000 for Topic 1 or CNY 250,000 for Topic 2. First-batch projects run for 12 months, from July 1, 2025 to June 30, 2026, and the first-batch call closed in May 2025. Each institution may submit only one application per research objective per topic, and eligible hosts include companies, universities, and research organizations, all Shanghai-registered.

The program uses a three-step submission process, with an unusual hardcopy requirement: five signed copies must be physically delivered by the deadline in addition to online submission. Strong applicants pick a single research objective per topic, present rigorous theoretical contributions positioned for the performance-based top-up, and prepare both the online and physical materials early. Applicants should watch for a second batch, expected in late 2025 or 2026, though no dates are yet confirmed.