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Program

Innovative Advanced Materials for photonics in telecommunication

Funds around two research projects, each worth up to EUR 5 million, to develop low-power advanced materials for photonic telecom chips.

Selected consortia run Research and Innovation Actions covering device design, materials fabrication, wafer-scale processing and prototype testing, expected to move projects from TRL 3 to TRL 6. Funded teams are expected to link into the IAM4EU partnership and European research infrastructures such as the ARIE analytical network.

Advanced MaterialsPhotonics

Each grant below is a distinct funding opportunity with its own eligibility, scope, and deliverables.