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Chips Joint Undertaking

Chips JU — Power Electronics

Funds European semiconductor consortia developing power electronics for advanced hardware.

Opens Jul'26European CommissionEUDeep-tech · core fit

Eligibility · EU member states

The Chips Joint Undertaking (Chips JU) is a tripartite public-public-private partnership established under the European Chips Act, bringing together the European Commission, participating EU Member States, and three industry associations — AENEAS, EPoSS, and INSIDE — to strengthen European competitiveness in semiconductor design, manufacturing, and packaging. The 2026 Power Electronics call targets research and innovation in power semiconductor technologies, including silicon carbide (SiC), gallium nitride (GaN), and advanced packaging approaches relevant to automotive, industrial, and energy infrastructure applications. A batch of 2026 Chips JU calls with a 7 May 2026 deadline carried a combined total budget of €110 million. The Power Electronics call (launch 7 July 2026, deadline 17 September 2026) is the subsequent open call within the same work programme cycle, targeting companies and research organisations working on high-power and wide-bandgap semiconductor technology.

Eligible applicants include for-profit companies, non-profit organisations, universities, and research bodies established in EU Member States or Chips JU-associated countries. National co-funding from participating Member States is typically required alongside EU-level Chips JU grants; applicants should verify the co-funding conditions for their country of establishment before applying. Individual applicants are not eligible. The Chips JU has its own governance and IP rules that differ in certain respects from standard Horizon Europe calls; state-aid classification may apply to some awards. Applications are submitted through the Chips JU website (chips-ju.europa.eu) and the EU Funding and Tenders Portal.

Organisations best positioned for this call combine strong IP in wide-bandgap semiconductors or advanced power module packaging with existing relationships in one of the key end-application sectors targeted by the EU Chips Act. Consortia that include both equipment manufacturers and application integrators tend to score well on impact criteria. Per-topic budget allocations are published in the Chips JU call documentation; individual topic budgets across the EDF 2026 broader ecosystem range from €14 million to over €150 million per topic, with Chips JU topic budgets similarly variable. Applicants should review the call topic descriptions on the Chips JU portal before scoping proposals.

Research and innovation in power semiconductor technologies — including silicon carbide (SiC), gallium nitride (GaN), and advanced packaging — to reinforce European competitiveness in power electronics under the Chips Joint Undertaking.

CycleiHow often this grant runs — e.g. annually, on a rolling basis, or a one-off call.Annual
Next deadlineiThe next date applications are due. Rolling means you can apply any time.17 Sept 2026
Decision timeiTypical time from the deadline to the funder's decision.
Project durationiHow long the funded work is expected to run.
Award typeiThe form of funding — grant, equity, loan, tax credit, etc.Grant
Match fundingiThe share of project costs you must cover yourself. 0% = fully funded.0%
Funding pooliThe total budget available across all awards in this round.€110M

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Last verified: 29 Jun 2026Source: www.chips-ju.europa.eu