Chips Joint Undertaking

The Chips Joint Undertaking sits under the European Commission as a tripartite public-public-private partnership with participating Member States and semiconductor industry associations. It implements the EU Chips Act and is intended to strengthen European chip design, manufacturing, and packaging capacity. By 2030, the combined funding ambition is roughly €11 billion when EU money, national matching contributions, and private investment are taken together. The instrument is a grant, with annual call cycles and national co-funding expected in many topics. The programme backs semiconductor pilot lines, advanced transistor nodes below 10 nm and below 2 nm, heterogeneous system integration, integrated photonic circuits, wide-bandgap materials such as SiC and GaN, FD-SOI, quantum chips, and competence centres. Recent 2026 calls included a main batch and a Power Electronics call with a €110 million budget. The strongest applicants show where they sit in the semiconductor value chain and how the project moves from research into pilot-line or industrial deployment. Chips Joint Undertaking runs with its own staff and procedures, so proposals need to follow its own call structure rather than treating it like an ordinary Horizon topic. Consortia that can combine technical depth with member-state participation are the most natural fit.

Each grant below is a distinct funding opportunity with its own eligibility, scope, and deliverables.