CHIPS NAPMP: Materials and Substrates R&D
Funds U.S. companies and institutions developing advanced packaging substrates and substrate materials to accelerate domestic semiconductor supply chain capacity.
CHIPS NAPMP Materials and Substrates NOFO 1 was issued by the CHIPS for America R&D program office under NIST and the Department of Commerce on February 28, 2024. It sits under the National Advanced Packaging Manufacturing Program (NAPMP), one of four R&D programs funded by the $11 billion CHIPS R&D investment. This was the first R&D NOFO issued by CHIPS for America. The program anticipated approx…
Advanced packaging substrates and substrate materials R&D, including glass-core substrates, silicon-core substrates, and fan-out wafer-level processing (FOWLP). Aimed at establishing domestic capacity for next-generation advanced packaging.
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