CHIPS NAPMP: Materials and Substrates R&D
Funds U.S. companies and institutions developing advanced packaging substrates and substrate materials to accelerate domestic semiconductor supply chain capacity.
About
CHIPS NAPMP Materials and Substrates NOFO 1 was issued by the CHIPS for America R&D program office under NIST and the Department of Commerce on February 28, 2024. It sits under the National Advanced Packaging Manufacturing Program (NAPMP), one of four R&D programs funded by the $11 billion CHIPS R&D investment. This was the first R&D NOFO issued by CHIPS for America. The program anticipated approx…
AIAdvanced ManufacturingAdvanced MaterialsSemiconductors
Each grant below is a distinct funding opportunity with its own eligibility, scope, and deliverables.