CHIPS Incentives — Semiconductor Materials & Equipment Facilities

CHIPS Incentives - Semiconductor Materials & Equipment Facilities is the upstream manufacturing channel in CHIPS for America, run by the U.S. Department of Commerce through the CHIPS Program Office. The program sits inside the $39 billion CHIPS incentives authority and is meant to strengthen domestic semiconductor supply chains by backing the facilities that make materials and equipment for U.S. chip fabs. The current opportunity supports construction, expansion, or modernization of commercial facilities that produce semiconductor materials or manufacturing equipment. It uses grants as the primary tool, with federal loans and loan guarantees also authorized, and it applies to U.S.-registered, U.S.-operating applicants in the supply chain. The process is two-stage: concept plans are accepted first, then the program invites selected applicants into full submissions, with the current concept-plan deadline running to November 1, 2026. This is a fit for large industrial projects that anchor domestic semiconductor clusters rather than for early-stage startups. The solicitation page does not disclose a dollar cap, which means applicants need to read the full criteria closely and build a capital stack that matches the scale of the facility and the federal review. The reopening and amendment in October 2025 show that the channel remains active and strategically important for upstream manufacturing resilience.

Each grant below is a distinct funding opportunity with its own eligibility, scope, and deliverables.