CJ
ProgramAdvanced packaging of chiplets and heterogeneous integration in Europe
Funds one consortium to coordinate Europe's advanced-packaging semiconductor ecosystem across supply-chain resilience, standardisation and workforce training.
About
This is a single-stage Digital Europe JU Coordination and Support Action with a topic budget of EUR 2,000,000, a minimum EU contribution of EUR 500,000 and a maximum of EUR 2,000,000, with 1 grant expected. Detailed eligibility and financial rules sit in Appendix 6.v6 of the Chips JU Work Programme. Applications go through the EU Funding & Tenders Portal.
Semiconductors
Each grant below is a distinct funding opportunity with its own eligibility, scope, and deliverables.