Chips Joint Undertaking (Chips JU)

Funds one consortium to coordinate Europe's advanced-packaging semiconductor ecosystem across supply-chain resilience, standardisation and workforce training.

Funds up to four teams to build edge AI chip prototypes that combine real-time on-device learning with ultra-low power consumption.

Funds up to five projects that speed the transfer of advanced-packaging semiconductor technology from Chips JU pilot lines into industrial deployment.

Funds one accelerator to bring strained silicon-on-insulator substrates to industrial-scale wafer production for 7nm FD-SOI chip manufacturing.

Pays one consortium up to EUR 70 million to build a common EU platform for evaluating and deploying European AI chips and racks.

Pays up to ten European chip companies between EUR 500,000 and EUR 1 million each to build working AI chip prototypes and get them tested on a shared EU evaluation platform.

Pays two EU-Japan semiconductor projects between EUR 3 million and EUR 5 million each to develop advanced chip packaging and standardised chiplet interfaces.

Pays up to two academic consortia between EUR 1 million and EUR 10 million each to build semiconductor 'Hubs of Excellence' offering industry-aligned degree programmes.

Pays one European federation of vocational-training providers up to EUR 10 million to build shared semiconductor micro-credentials and reskilling programmes.

Pays one consortium up to EUR 15 million to run a Europe-wide chip-design skills programme, funding at least 1,000 student tape-outs over four years.

Pays a coordination action that connects EU and Japanese semiconductor researchers and companies to plan joint chip R&I and secure the chip supply chain.

Funds up to four consortia building or improving open-source chip-design (EDA) tools for digital, analogue and mixed-signal design, released under an open-source licence.

Funds two teams prototyping ultra-low-power edge AI chip designs, tested at TRL 6-7 for real-time on-device inference in battery-powered devices.

Funds around twelve open-topic chip Innovation Action projects — pilot lines, test beds, demonstrators or market-replication pilots — anywhere across the Chips JU's technology and application roadmap.

Funds up to two teams building a high-performance RISC-V automotive hardware platform — processors, AI accelerators and the software tool-chain — for autonomous driving.

Funds one team building an open AI-assisted platform, including generative AI, that automates chip and software-defined-vehicle engineering tasks across design, deployment and maintenance.

Funds around ten early-stage chip research projects, TRL 3-4, that develop and lab-test innovative technologies against the Chips JU's roadmap of key application areas.

Funds around five chip Innovation Action projects at TRL 5-8 — pilot lines, full-scale test zones or new frameworks used in real products — anywhere on the Chips JU's 2026 roadmap.

Funds around eight early-stage chip research projects, TRL 3-4, that develop and lab-test innovative technologies against the Chips JU's 2026 roadmap.

Funds a coordination action building a secure data platform that maps and stress-tests the EU semiconductor supply chain.

Funds research and testing of front-end-module microelectronics for future 6G radio systems.

Funds joint EU-partner-country research on neuromorphic computing, advanced packaging and semiconductor manufacturing.

Funds innovation in wide-bandgap power semiconductors, advanced packaging and AI-assisted power-electronics design.

Funds scaling of photonic-chip manufacturing, packaging and system integration for AI, sensing and telecom applications.

Funds electronic-components-based innovation for personalised monitoring, disease prevention and secure healthcare data systems.

Funds one team building an open AI-assisted platform, including generative AI, that automates chip and software-defined-vehicle engineering tasks across design, deployment and maintenance.

Funds one coordination action building the Chips JU's own indicator, data-collection and impact-assessment system.

Funds one coordination action steering Europe's open-source, software-defined autonomous-driving vehicle stack.