Advanced packaging of chiplets and heterogeneous integration in Europe
Funds one consortium to coordinate Europe's advanced-packaging semiconductor ecosystem across supply-chain resilience, standardisation and workforce training.
Advanced packaging of chiplets and heterogeneous integration in Europe is a Chips Joint Undertaking (Chips JU) grant that funds one consortium to coordinate Europe's advanced-packaging semiconductor ecosystem across supply-chain resilience, standardisation and workforce training. As a Coordination and Support Action, it is expected to deliver results across six named outcome areas: more resilient …
This call funds a Coordination and Support Action to build a more resilient, sustainable and competitive European advanced-packaging ecosystem, covering chiplets and heterogeneous integration for sectors like automotive, aerospace, healthcare, security and telecommunications. It targets a public vulnerability assessment of the supply chain, standardisation, and a harmonised roadmap linking EU R&I to industrial implementation.
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