CJ
ProgramLab to Fab Accelerators for Advanced Packaging and heterogeneous integration
Funds up to five projects that speed the transfer of advanced-packaging semiconductor technology from Chips JU pilot lines into industrial deployment.
About
This is a single-stage Digital Europe JU Simple Grant with a topic budget of EUR 50,000,000, a minimum EU contribution of EUR 500,000 and a maximum of EUR 15,000,000, with 5 grants expected. Detailed eligibility sits in Appendix 6.v6 of the Chips JU Work Programme. Applications go through the EU Funding & Tenders Portal.
Semiconductors
Each grant below is a distinct funding opportunity with its own eligibility, scope, and deliverables.