Lab to Fab Accelerators for Advanced Packaging and heterogeneous integration
Funds up to five projects that speed the transfer of advanced-packaging semiconductor technology from Chips JU pilot lines into industrial deployment.
Lab to Fab Accelerators for Advanced Packaging and heterogeneous integration is a Chips Joint Undertaking (Chips JU) grant that funds up to five projects to speed the transfer of advanced-packaging semiconductor technology from Chips JU pilot lines into industrial deployment, targeting European semiconductor packaging companies and their supply chains from materials and substrate providers through…
This call funds Lab to Fab Accelerator (LFA) projects that speed up the transfer of advanced-packaging and heterogeneous-integration technology from research and technology organisations' pilot lines to industrial deployment. It targets European semiconductor packaging companies and their supply chains, from materials and substrate providers through packaging companies to their European customers.
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