CJ
ProgramStrained silicon-on-insulator substrates for 7nm FD-SOI semiconductor manufacturing
Funds one accelerator to bring strained silicon-on-insulator substrates to industrial-scale wafer production for 7nm FD-SOI chip manufacturing.
About
This is a single-stage Digital Europe JU Simple Grant with a topic budget and maximum EU contribution both set at EUR 30,000,000, a minimum EU contribution of EUR 1,000,000, and 1 grant expected. Detailed eligibility sits in Appendix 6-v4 of the Chips JU Work Programme. Applications go through the EU Funding & Tenders Portal.
Semiconductors
Each grant below is a distinct funding opportunity with its own eligibility, scope, and deliverables.