Strained silicon-on-insulator substrates for 7nm FD-SOI semiconductor manufacturing
Funds one accelerator to bring strained silicon-on-insulator substrates to industrial-scale wafer production for 7nm FD-SOI chip manufacturing.
Strained silicon-on-insulator substrates for 7nm FD-SOI semiconductor manufacturing is a Chips Joint Undertaking (Chips JU) grant that funds one accelerator to bring strained silicon-on-insulator (sSOI) substrates to industrial-scale wafer production for 7nm FD-SOI chip manufacturing. The accelerator is expected to have a particular focus on complementarity with the FD-SOI pilot line, working alon…
This call funds an accelerator that develops industrial-grade strained silicon-on-insulator (sSOI) substrates and Process Design Kits, targeting readiness for high-volume 7nm FD-SOI semiconductor manufacturing by 2030. It covers strain-engineering, wafer bonding, defect reduction and process integration, plus training programmes for European technologists and engineers.
Sign up free to see the funding breakdown
Sign up free to see the industries in scope
Sign up free to see the full eligibility
Sign up free to see how to apply
Sign up free to see what you submit
Sign up free to see the timeline
Sign up free to see where teams trip up
Guides for this application
All guides →Grant Work Plan Template: Work Packages, Gantt, Milestones, and Risks
Use this grant work plan template to structure work packages, tasks, owners, deliverables, Gantt timing, dependencies, and risk registers.
Find grantsGovernment Grants for Startups: What Deeptech Founders Should Know
A practical guide to government grants for startups, including Grants.gov, SBIR/STTR, state programs, eligibility, fit, timelines, and when to apply.
BudgetGrant Budget Template for R&D Applications
Use this grant budget template to structure R&D costs, personnel, subcontractors, equipment, indirect costs, and budget justification for startup grant applications.
More from Chips JU
All grants from this funder →AI chip demonstrators for EU compute infrastructure
🇪🇺Chips JU · European Union
Pays up to ten European chip companies between EUR 500,000 and EUR 1 million each to build working AI chip prototypes and get them tested on a shared EU evaluation platform.
AI compute evaluation and deployment platform for EU infrastructure
🇪🇺Chips JU · European Union
Pays one consortium up to EUR 70 million to build a common EU platform for evaluating and deploying European AI chips and racks.
International collaboration EU and Japan on semiconductors
🇪🇺Chips JU · European Union
Pays two EU-Japan semiconductor projects between EUR 3 million and EUR 5 million each to develop advanced chip packaging and standardised chiplet interfaces.
Advanced packaging of chiplets and heterogeneous integration in Europe
🇪🇺Chips JU · European Union
Funds one consortium to coordinate Europe's advanced-packaging semiconductor ecosystem across supply-chain resilience, standardisation and workforce training.
AI-assisted Methods and Tools for Engineering Automation (Chips JU 2025 call)
🇪🇺Chips JU · European Union
Funds one team building an open AI-assisted platform, including generative AI, that automates chip and software-defined-vehicle engineering tasks across design, deployment and maintenance.
AI-assisted Methods and Tools for Engineering Automation (Chips JU 2026 call)
🇪🇺Chips JU · European Union
Funds one team building an open AI-assisted platform, including generative AI, that automates chip and software-defined-vehicle engineering tasks across design, deployment and maintenance.
Similar grants
Browse the directory →
Portugal CHIPS Strategy — National Semiconductor (seed)
🇵🇹ANI · Portugal
Funds semiconductor development efforts supporting advanced manufacturing capacity to strengthen real-world implementation.
HTSM Call — Semiconductors & Quantum
🇳🇱Holland High Tech · Netherlands
Funds Dutch hardware and quantum development ideas through a call that connects research with scaling in semiconductor technologies.
Access to Research Infrastructure Services for EU Priorities and Emerging Challenges
🇪🇺European Commission · European Union
Funds €6M consortia that open Europe’s best research infrastructures to challenge-driven users and EU priorities.
Horizon Space: Radiation-Hard FPGA on 7nm
🇪🇺European Commission · European Union
Funds one EU project, up to €13M, to build and qualify a radiation-hardened FPGA chip so Europe's space missions stop depending on non-EU suppliers.
WIPANO Patenting for Companies
🇩🇪BMWE · Germany
Funds German small and medium-sized enterprises protecting their own research and development results with patents and other industrial property rights through WIPANO.
WIPANO Standards Participation for Companies
🇩🇪BMWE · Germany
Funds German companies with up to 1,000 employees taking part in national, European, and international standardization committees through WIPANO.