CJ
ProgramInternational collaboration EU and Japan on semiconductors
Pays two EU-Japan semiconductor projects between EUR 3 million and EUR 5 million each to develop advanced chip packaging and standardised chiplet interfaces.
About
This simple grant funds two projects, each receiving between EUR 3 million and EUR 5 million, through the EU Funding & Tenders Portal before the earlier 2026-09-24 deadline. Full admissibility, eligibility and evaluation rules sit in Appendix 8 of the Chips JU Work Programme for the Chips for Europe Initiative.
PhotonicsSemiconductors
Each grant below is a distinct funding opportunity with its own eligibility, scope, and deliverables.