International collaboration EU and Japan on semiconductors
Pays two EU-Japan semiconductor projects between EUR 3 million and EUR 5 million each to develop advanced chip packaging and standardised chiplet interfaces.
International collaboration EU and Japan on semiconductors is a Chips Joint Undertaking (Chips JU) simple grant that pays two joint EU-Japan semiconductor projects between EUR 3 million and EUR 5 million each to develop advanced heterogeneous chip integration, 2.5D and 3D packaging, integrated photonics for AI, and standardised chiplet interfaces for a wider chiplet ecosystem. Work should span Tec…
The Chips JU wants joint EU-Japan projects on advanced heterogeneous chip integration, 2.5D and 3D packaging, integrated photonics for AI, and on standardised chiplet interfaces that support a wider chiplet ecosystem. Work should span Technology Readiness Levels 5 to 7, meaning solutions proven in the lab through to pilot-scale manufacturing use cases.
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