CJ
ProgramIA Resilience call reinforcing Europe's strenght in power electronics
Funds innovation in wide-bandgap power semiconductors, advanced packaging and AI-assisted power-electronics design.
About
One consortium carries out the work under a single-stage Innovation Action, funded as a lump sum. The Chips JU expects two grants from this topic's EUR 20,000,000 pot, each up to EUR 10,000,000.
Energy TechSemiconductors
Each grant below is a distinct funding opportunity with its own eligibility, scope, and deliverables.