IA Resilience call reinforcing Europe's strenght in power electronics
Funds innovation in wide-bandgap power semiconductors, advanced packaging and AI-assisted power-electronics design.
One consortium carries out the work under a single-stage Innovation Action, funded as a lump sum. The Chips JU expects two grants from this topic's EUR 20,000,000 pot, each up to EUR 10,000,000.
This topic funds innovation projects on wide-bandgap (WBG) power semiconductor substrates and platforms, cost-effective 300mm GaN and SiC processes, and new power-device packaging and integration. It also wants advanced characterisation techniques and the use of AI, at the system level or in the design process, to speed up innovation.
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