Call with Digital Partnership and TTC countries
Funds joint EU-partner-country research on neuromorphic computing, advanced packaging and semiconductor manufacturing.
Consortia bring together European and Digital Partnership country R&I communities under a single-stage Research and Innovation Action. The Chips JU expects three grants from this topic's EUR 5,000,000 pot, each up to EUR 5,000,000.
This topic funds collaborative research between European and Digital Partnership country teams in areas where those countries bring complementary strength, including advanced packaging, heterogeneous integration and photonic chip technologies. It wants innovative neuromorphic-computing designs for low-power mobile applications, alternative semiconductor manufacturing processes, and advanced packaging for communications, sensing and power-management applications.
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