IA Resilience call reinforcing Europe's strength in photonics
Funds scaling of photonic-chip manufacturing, packaging and system integration for AI, sensing and telecom applications.
One consortium carries out the work under a single-stage Innovation Action, funded as a lump sum. The Chips JU expects two grants from this topic's EUR 20,000,000 pot, each up to EUR 10,000,000.
This topic funds work scaling wafer-level photonic processes for materials such as SiN, InP and GaAs, and developing automated packaging and test solutions compatible with co-packaged optics. It wants heterogeneous integration of lasers, modulators and detectors, plus design-process-equipment co-optimisation demonstrated in a real application such as AI, sensing, telecom, mobility, health or defence.
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