IA Resilience call reinforcing Europe's strength in photonics
Funds scaling of photonic-chip manufacturing, packaging and system integration for AI, sensing and telecom applications.
One consortium carries out the work under a single-stage Innovation Action, funded as a lump sum. The Chips JU expects two grants from this topic's EUR 20,000,000 pot, each up to EUR 10,000,000.
This topic funds work scaling wafer-level photonic processes for materials such as SiN, InP and GaAs, and developing automated packaging and test solutions compatible with co-packaged optics. It wants heterogeneous integration of lasers, modulators and detectors, plus design-process-equipment co-optimisation demonstrated in a real application such as AI, sensing, telecom, mobility, health or defence.
Sign up free to see the funding breakdown
Sign up free to see the industries in scope
Sign up free to see the full eligibility
Sign up free to see how to apply
Sign up free to see what you submit
Sign up free to see the timeline
Sign up free to see where teams trip up
Guides for this application
All guides →Horizon Europe Grants for Startups: A Founder Guide
A practical guide to Horizon Europe grants for startups, including EIC, consortia, eligibility, Funding & Tenders, TRL, budgets, and EU strategy.
DocumentsGrant Work Plan Template: Work Packages, Gantt, Milestones, and Risks
Use this grant work plan template to structure work packages, tasks, owners, deliverables, Gantt timing, dependencies, and risk registers.
DocumentsLetter of Support for Grant Applications: Template and Examples
Learn how to write and request a letter of support for a grant, with template structure, examples, reviewer logic, and common mistakes.
Find grantsGovernment Grants for Startups: What Deeptech Founders Should Know
A practical guide to government grants for startups, including Grants.gov, SBIR/STTR, state programs, eligibility, fit, timelines, and when to apply.
More from Chips JU
All grants from this funder →Call with Digital Partnership and TTC countries
Chips JU · European Union
Funds joint EU-partner-country research on neuromorphic computing, advanced packaging and semiconductor manufacturing.
IA Resilience call reinforcing Europe's strenght in health
Chips JU · European Union
Funds electronic-components-based innovation for personalised monitoring, disease prevention and secure healthcare data systems.
IA Resilience call reinforcing Europe's strenght in power electronics
Chips JU · European Union
Funds innovation in wide-bandgap power semiconductors, advanced packaging and AI-assisted power-electronics design.
RIA Resilience call reinforcing Europe's strength in 6G radio communication systems
Chips JU · European Union
Funds research and testing of front-end-module microelectronics for future 6G radio systems.
Coordination of the European software-defined vehicle platform
Chips JU · European Union
Funds one coordination action steering Europe's open-source, software-defined autonomous-driving vehicle stack.
Supply chain resilience CSA
Chips JU · European Union
Funds a coordination action building a secure data platform that maps and stress-tests the EU semiconductor supply chain.
Similar grants
Browse the directory →
Defence Rapid Impact
UKDI / DASA · United Kingdom
Funds innovators from any country developing near-term defence technology prototypes at TRL 6 or 7 through the MOD Defence Innovation Fund.
Eurostars Call 11
🇪🇺EUREKA · Global / Multinational
Funds small and medium enterprises across Europe via Eurostars Call 11 for collaborative innovation with international partners.
ECosystem for Leading Innovation in Plasma Science and Engineering (ECLIPSE)
🇺🇸NSF · United States
Funds plasma science aimed at real technological problems — manufacturing, microelectronics, agriculture, sensors, nanomaterials.
Open Call for Innovation
UKDI / DASA · United Kingdom
Funds organisations worldwide developing novel defence and security innovations across any technology area from TRL 1 to TRL 8.
Advanced Photonic Devices and Circuits
🇪🇺European Commission · European Union
Funds six €3–5M research projects that make integrated photonic circuits more capable, compact and power-efficient.
Engineering (ENG): Electrical, Communications, and Computing Systems (ECCS)
🇺🇸NSF · United States
Funds foundational engineering research on devices, circuits and control — $110 million across roughly 300 awards, with no deadline.