Semiconductors grants in Israel

Between cycles

Funds innovative SME-led international R&D consortia through the Eurostars Call 12 grant process.

Between cycles

Funds early-stage deep tech startups developing solutions at TRL 4-5 in collaboration with industry partners through a 4-month co-creation programme.

Between cycles

Funds five lump-sum grants, each €3-4M, for tools that harden chip design or software supply chains against tampering, backdoors, and compromised dependencies.

Closed

Funds bottom-up research for breakthrough deep-tech, any field of science.

Closed

Supports European deep-tech ventures advancing laboratory research toward validated prototypes and near-market technologies.

Closed

Pays up to 25 small consortia EUR 200,000 each to test the commercial exploitation potential of results that already came out of earlier Horizon Europe or Horizon 2020 Cluster 4 projects.

Closed

Funds one team building an open AI-assisted platform, including generative AI, that automates chip and software-defined-vehicle engineering tasks across design, deployment and maintenance.

Closed

Funds one team building an open AI-assisted platform, including generative AI, that automates chip and software-defined-vehicle engineering tasks across design, deployment and maintenance.

Closed

Supports international consortia so small companies can turn joint innovation into export-ready products.

Closed

Funds a complete tunable 6G radio front-end module for 7–15 GHz, combining European microelectronics with low-energy operation.

Closed

Funds a pan-European network of 10-18 startup and scaleup hubs that can pass on up to EUR 60,000 per deep-tech startup for cross-border scaling support.

Closed

Funds small and medium enterprises across Europe via Eurostars Call 11 for collaborative innovation with international partners.

Closed

Pays one European consortium EUR 1 million to coordinate the 2D-materials research community, including Graphene Flagship projects, and keep a live map of European funding in the field.

Closed

Funds around twelve open-topic chip Innovation Action projects — pilot lines, test beds, demonstrators or market-replication pilots — anywhere across the Chips JU's technology and application roadmap.

Closed

Funds around ten early-stage chip research projects, TRL 3-4, that develop and lab-test innovative technologies against the Chips JU's roadmap of key application areas.

Closed

Pays a coordination action that connects EU and Japanese semiconductor researchers and companies to plan joint chip R&I and secure the chip supply chain.

Closed

Funds around five chip Innovation Action projects at TRL 5-8 — pilot lines, full-scale test zones or new frameworks used in real products — anywhere on the Chips JU's 2026 roadmap.

Closed

Funds industrial consortia that develop more sustainable, cost-effective ways to extract, process or refine raw materials used in semiconductor manufacturing.

Closed

Pays one coordination project to map semiconductor cooperation opportunities with countries such as Japan, Korea and the United States for the Commission.

Closed

Funds two teams prototyping ultra-low-power edge AI chip designs, tested at TRL 6-7 for real-time on-device inference in battery-powered devices.

Closed

Funds up to four consortia building or improving open-source chip-design (EDA) tools for digital, analogue and mixed-signal design, released under an open-source licence.

Closed

Funds consortiums including a silicon wafer manufacturer to develop cheaper, lower-energy ways to grow silicon ingots and wafers for solar cells.

Closed

Pays one European federation of vocational-training providers up to EUR 10 million to build shared semiconductor micro-credentials and reskilling programmes.

Closed

Funds around eight early-stage chip research projects, TRL 3-4, that develop and lab-test innovative technologies against the Chips JU's 2026 roadmap.