Semiconductors grants in the Netherlands

Funds up to four teams to build edge AI chip prototypes that combine real-time on-device learning with ultra-low power consumption.

Closed

Funds a complete tunable 6G radio front-end module for 7–15 GHz, combining European microelectronics with low-energy operation.

Closed

Funds a pan-European network of 10-18 startup and scaleup hubs that can pass on up to EUR 60,000 per deep-tech startup for cross-border scaling support.

Closed

Pays one European consortium EUR 1 million to coordinate the 2D-materials research community, including Graphene Flagship projects, and keep a live map of European funding in the field.

Funds around twelve open-topic chip Innovation Action projects — pilot lines, test beds, demonstrators or market-replication pilots — anywhere across the Chips JU's technology and application roadmap.

Funds around ten early-stage chip research projects, TRL 3-4, that develop and lab-test innovative technologies against the Chips JU's roadmap of key application areas.

Closed

Funds one €3–4M project turning a prototype irradiation facility into a booked-beam-time service for radiation-testing Europe’s space chips.

Closed

Funds one EU project, up to €13M, to build and qualify a radiation-hardened FPGA chip so Europe's space missions stop depending on non-EU suppliers.

Closed

Funds one €6–7M project to industrialise an EU source of semi-insulating SiC substrates — the wafer base for the GaN chips in satellite radios.

Pays a coordination action that connects EU and Japanese semiconductor researchers and companies to plan joint chip R&I and secure the chip supply chain.

Funds around five chip Innovation Action projects at TRL 5-8 — pilot lines, full-scale test zones or new frameworks used in real products — anywhere on the Chips JU's 2026 roadmap.

Closed

Funds industrial consortia that develop more sustainable, cost-effective ways to extract, process or refine raw materials used in semiconductor manufacturing.

Closed

Pays one coordination project to map semiconductor cooperation opportunities with countries such as Japan, Korea and the United States for the Commission.

Funds up to five projects that speed the transfer of advanced-packaging semiconductor technology from Chips JU pilot lines into industrial deployment.

Funds two teams prototyping ultra-low-power edge AI chip designs, tested at TRL 6-7 for real-time on-device inference in battery-powered devices.

Funds one project to design a European front-end-module chipset for 6G radio in the FR3 (7-15 GHz) frequency range.

Funds up to four consortia building or improving open-source chip-design (EDA) tools for digital, analogue and mixed-signal design, released under an open-source licence.

Closed

Funds consortiums including a silicon wafer manufacturer to develop cheaper, lower-energy ways to grow silicon ingots and wafers for solar cells.

Funds around eight early-stage chip research projects, TRL 3-4, that develop and lab-test innovative technologies against the Chips JU's 2026 roadmap.

Funds up to two teams building a high-performance RISC-V automotive hardware platform — processors, AI accelerators and the software tool-chain — for autonomous driving.

Funds one accelerator to bring strained silicon-on-insulator substrates to industrial-scale wafer production for 7nm FD-SOI chip manufacturing.

Closed

Pays one European consortium EUR 1 million to map semiconductor regional clusters, share best practice on permitting and infrastructure, and build an online platform connecting them.

Closed

Funds one coordination project up to EUR 1 million to build a support network and information hub for Europe's fabless semiconductor start-ups and SMEs.

Closed

Pays for the secretariat that runs Europe's semiconductor industry alliance, coordinating roadmaps, working groups and an annual assembly.